钛及钛合金与非金属材料的扩散连接技术是当前材料连接领域的热点之一。
The diffusion bonding technique of titanium or titanium alloy and nonmetals is one of the central issues in materials bonding field now.
半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
扩散偶和合金样品采用光学显微镜、扫描电镜和电子探针显微分析技术进行分析。
Both the diffusion couple specimens and the alloys were examined by means of optical microscopy, scanning electron microscopy, and electron probe microanalysis.
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