下列因素是必须被考虑的：包括合金的类型、锡粉的粒径大小以及助焊剂的类型。
Factors, which must be taken into consideration, include the type of alloy, the size of the solder powder and the type of flux.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
焊料表面氧化层厚度的减小能够降低焊接过程中焊料粉末的结合阻力，助焊剂更容易将氧化物清除，有助于焊料合金的融合。
The oxide thinning process could not only reduce the coalescent resistance of solder alloys during melting but also make the complete removal of oxide with flux easier.
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