问：大多数数码相机都使用电荷藕合器件（CCD，charge-couple device）作为图象传感，现在也有一些产品开始采用CMOS传感器了，请问CMOS传感器的主要特点是什么？
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电荷耦合器件 CCD ; Charge Coupled Device ; CCDCharge coupled devices ; Coupled Device
光耦合器件 LMDS Light Coupled Device ; Light Coupled Device ; LCDLightCoupledDevice
光电耦合器件 OPTO-COUPLER ; Optoelectronic coupler ; CCD ; charge-coupled device
混合器件 hybrid device ; Mixed Components
增强型电荷耦合器件 ICCD ; intensified charge coupled device
电子倍增电荷耦合器件 EMCCD ; electron multiplying charge-coupled device
电荷藕合器件 charge-couple device ; CCD
耦合器件 coupled apparatus ; CCD ; Charge Coupled Devices ; coupled device
增强电荷耦合器件 Intensified CCD/ICCD ; ICCD
在MEMS器件的设计与加工过程中，键合技术是体硅工艺的一项关键技术。
In the design and fabrication of MEMS devices, MEMS fabrication process based on Silicon is a main technology, to which is deeply paid attention by researchers and industries.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
金属键合可以实现衬底倒扣和改善器件热学性能，而对器件原有的光学性质影响不大。
Metallic bonding can realize up -down assembly and improve the thermal property. But it has little influence on the original optical property of the device.
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