应用有限元分析软件ANSYS，模拟功率载荷下叠层芯片封装中各层的温度和应力分布。
The finite element analysis (FET) software ANSYS have been used to simulate the temperature and stress distribution in stacked die package under power load.
研究了温度循环载荷下叠层芯片封装元件(scsp)的热应力分布情况，建立了SCSP的有限元模型。
A finite element modeling of SCSP was performed. The distribution of thermal stress of SCSP under temperature cycle was analyzed.
在叠层的组装工艺中，比如基板- 焊片- 芯片，即使有部分表面被盖住了，这种气氛同样有效。
This is also preformed on covered surfaces a stacked assembly : substrate - pre - form - die.
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