opposite arc
·2,447,543篇论文数据，部分数据来源于NoteExpress
传统的前向拱丝越来越难以满足目前封装的高密度要求，反向拱丝能满足非常低的弧高的要求。
Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.
youdao
应用推荐
模块上移
模块下移
不移动