本文主要介绍在国产双面抛光机上一次同时完成的硅片双面抛光技术。

This article mainly introduces the technique of having both sides of silicon wafers polished simultaneously on the polishing machine made domestically.

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结果表明气动伺服加载系统能满足双面抛光的要求，可以加工出双面超平滑的硅片。

This pneumatic servo load system can satisfy the needs of double-sided polishing machine, which can successfully produce the ultra-smooth and flat surface on both sides of silicon wafer.

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双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。

Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions.

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