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... semiconductor resistor 半导体电阻器 semiconductor slice 半导体薄片 semiconductor substrate 半导体衬底 ...
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本文给出了有相异表面复合速度时半导体薄片少子连续方程的一种新解法。
This paper presents a new solution of minority carrier continuity equation for a wafer with different surface recombination velocity on its two surfaces.
这两种芯片都是先在一张半导体薄片上成批生产，然后再切割成一个个芯片的。
Both types of chip are manufactured in batches on a single semiconductor wafer that is cut into individual chips.
这些微晶是一种叫作磷化铟的半导体化合物，它们被喷撒在一张透明塑料薄片上，然后用另一张薄片盖好。
The dots, composed of a semiconductor called indium phosphide, are sprayed onto a transparent plastic sheet that is then covered with a second sheet.
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