主要PCB加工类型有:化学镀镍金(immersion gold)、无铅沉锡、锡(HASL)、有机助焊保护膜(Entek),沉银(Immersion sliver)及HDI等,可加FR4,FR5,RCC,CEM-1,CEM-3,纸板,及陶瓷板,金属...
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化学镀镍浸金 ENIG
化学镀镍钯浸金 ENEPIG
化学镀镍-磷合金镀层 Autocatalytic nickel-phosphorus alloy coatings
化学镀镍磷合金 electroless Ni-P alloy plating
本文总结了影响化学镀镍金可焊性的复杂因素如：前处理的影响、化学镀镍过程的影响、浸金的影响、浸金后水洗的影响、焊料的影响。
This paper servers as a summary review of the complex factors such as the prepare, the process of electroless nickel, immersion gold, the rinse after immersion gold, the solder.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
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