本论文主要集中在:(1)利用 金属辅助白勺化学刻蚀(Metal-Assisted Chemical Etching, MACE)白勺方法制备生长可控、外表光滑白勺SiNWs阵列;(2)通过实验和利用严格耦合波分析(Rigorou...
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衬底预处理采用化学刻蚀和高温处理。
Chemical etching and high temperature heating were used for pretreatment of substrates.
本文的主要内容包括: (1)阐述了准分子激光电化学刻蚀硅工艺的基本原理。
The thesis comprises 3 parts: (1) The basic principle of the process is described.
本发明还公布了与光成像组合物配合使用,对玻璃,硅晶片、金属基材等进行深度刻蚀的化学刻蚀剂。
The invention also discloses a chemical etching agent matched with the compound to take deep etch to glass, silicon water and metal material.
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