一般说来，剪切键承载能力主要受预埋件控制，但在制定现行规范时对多排多列角钢预埋件的试验研究较少。
Generally speaking the loading capacity of shear key is mainly governed by embedded part, while quite few test have been taken to the embedded part when the on -going specification is established.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
本文介绍了某微波组件芯片剪切力和键合强度的改进案例。
In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced.
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