...封装外围角点处焊点剥离应力最大,位于焊点靠近封装一侧,表明靠近封装一侧焊点部位容易开裂失效;以最大的剥离应力(peeling stress)作为跌落碰撞底焊点的失效准则,用Power原理建立的寿命预测模型,计算得到两种无铅焊料Sn3.0Ag0.5Cu和Sn3.5Ag的平均碰撞寿命分别为...
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对各种参数进行分析，得到了两种不同剥离破坏形式下的最大粘结剥离应力；
The main factors of debonding failure and maximum debonding stress of two types of failure mode are drawn through the analysis of various parameters.
试验结果表明：降低应力集中及剥离应力小的接头形式可有效地提高胶接强度。
The results show that the joint forms which have less stress, concentration and less peel stress can raise bonding strength greatly.
对受弯构件受拉翼缘外侧粘贴FRP后的界面剪应力和界面剥离应力进行了分析。
The interfacial shear stress and peel stress between the FRP and the surface of tension flange were analyzed when the FRP was bonded to the tension flange of the bending members.
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