当铜合金表面的电镀纯铜层厚度超过一个临界值，表面电镀纯铜处理可以明显改善材料的耐氧化剥离性。
As the electroplating pure copper layer on copper alloy exceeds a critical thickness, the surface electroplating treatment can improve the copper alloy's resistance against oxidation failure greatly.
由谱峰强度公式导出了吸附层的厚度和离子束对其剥离速率的表达式。
We derived formulas of thickness of absorbed layer and etching rate of an ion beam from the formula of intensity peaks.
影响这种剥离破坏的主要因素有两个：一是粘贴钢板的端部与加固梁支座距离； 二是粘贴钢板的厚度。
This particular failure depends on two factors such as the distance of plate end from the support and plate thickness.
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