光刻工艺的基本步骤之一，也被称为软烘。即在一定的温度下，使光刻胶膜里面的溶剂缓慢地、充分地逸出来，使光刻胶膜干燥。
他在炉火前烘脚。
着重研究了光刻胶的前烘胶温度、回流温度、回流时间对回流效果的影响。
The impact of prebake temperature, reflow temperature and reflow time on the effect of pr reflowing is studied.
初步研究了SU-8胶的光刻工艺流程，讨论了涂胶、前烘等各个步骤对光刻结果的影响。
The process of SU-8 photoresist lithography is researched, and the influence of steps like coating and soft-bake on the lithography is studied.
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