主要之制程参数包括气源中之氢气含量、电浆前处理、材偏压、积温度以及电浆导流板之施加。
The main process parameters include hydrogen content in the gas sources, hydrogen plasma catalyst pretreatment, substrate bias, deposition temperature and plasma flow guiding.
裸板制造制程，在设计完成后装配开始前。
Fabrication The bare-board manufacturing process, which begins after design but before assembly.
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