制造部门在他们自己的EIS中创建了新的产品描述。
Manufacturing created a new product description in its own EIS.
另一方面，比起制造部门，技术部门的雇用更接近于衰退前的水平。
On the other hand, employment on the tech side is much closer to pre-recession levels than employment on the manufacturing side.
为了处理上述挑战，IBM 的 System Technology Group (STG) 半导体制造部门基于集成的模块化体系结构创建了一套解决方案。
To address the above-described challenges, IBM's System Technology Group (STG) semiconductor manufacturing created solution based on an integrated modularized architecture.
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