... wafer dicing saw 切片锯 ; 转让划片机 Wafer saw Commissioning Engineer 硅片锯调试工程师 Wafer Saw Service Engineer 硅片锯设备维护工程师 ; 上海 ...
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对锯切硅片时各工艺参数对切片表面质量的影响规律进行了理论研究。
The influences of technology parameters on silicon wafer surface quality when slicing are studied theoretically.
由于线锯切割具有切片薄、表面翘曲变形小、厚薄均匀和切口损失小等优点，被广泛用于单晶硅切片加工。
The wire sawing process has been applied to slice single silicon into thin wafers for its character of minimum warp, uniform thickness and low kerf loss.
目的：探讨利用Leitz-1600型锯割切片机及骨磨片技术进行种植体骨结合状况的组织学研究方法。
Objective: To explore the methods on metal-bone interface integration with Leitz-1600 saw microtome and bone grinding slice technique.
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