作者利用双晶X射线衍射技术，研究了不同切割速率下硅晶片的切割损伤。
By means of technique of X-ray double crystal diffraction, the different cutting damages of silicon slices have been studied.
结果表明，水压、沙流量和切割速率是影响钛及钛合金中厚板切割质量的主要因素；
The results show that the major influence factors of the cutting quality for thick titanium and its alloy plate are water pressure, sand flux rate and cutting rate.
通过改变精氨酸的某些性质，研究人员能够控制谷胱甘肽切割精氨酸-紫杉醇复合体的速率。
By altering certain aspects of the arginine, the researchers were able to control the rate at which glutathione slices and dices the arginine-Taxol complex.
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