实现切割精度高，并且可以实现微量切割。
Laser cutting reaches high precision, and can realize tiny cutting.
现场使用表明：该系统具有自动化程度高，切割精度高，产品成本低等优点。
After using, the system has many merits such as high degree of automation, high precision of cutting and low costs etc.
多层片式电子元件大批量生产过程中的切割工序对切割设备的要求主要有切割精度高，稳定性好，生产效率高。
Cutting process is very important for making multi-layer chip electronic components. The cutting machine shall meet the following requirements: high cutting accuracy, stability and efficiency.
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