我们认为，近完整晶体的切割损伤层是由多晶层、嵌镶结构层和畸变层组成。

We consider that damage layers on near perfect crystal consist of polycrystal layer, Mosaic structure layer and distorted layer.

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在大尺寸半导体基片和功能晶体的切割中。固结磨料线锯以无可比拟的优点被认为是最好的切割方法之一。

Fixed abrasive wire saw is recognized as one of the best methods in cutting large size semiconductor chip and function crystal because of its incomparable advantages.

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在晶体加工中，特殊晶向及晶体棱镜的切割一直是困扰加工者的一大难题。

It is always a great difficult around fabricators to cut the special orientation and prism of crystal in the cutting process.

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