作为一个例子，植入体的金属性表面可以被处理以在表面内形成凹坑，接着可选地通过光滑化步骤减小所述带凹坑的表面的粗糙度。
As one example, a metallic surface of an implant can be treated to form pits in the surface, followed optionally by a smoothing step to reduce the roughness of the pitted surface.
形成的小凹坑起到应力增高源的作用。
The small pits that form on the surface act as stress raisers.
基底凹坑的形成主要由基底熔化所控制。
The formation of the craters on the substrate is mainly controlled by substrate melting.
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