减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
应用表明：ANSYS的模拟精度高，图形显示功能强。应用ANSYS自动寻优功能使RC延迟最佳化几何参数的寻找较为迅速和直观。
Its showed that the auto optimization function of ANSYS can help to rapidly and intuitively seek the optimally geometrical parameters which minimize the RC delay.
利用互相关技术，计算信号在不同传感器上的时间延迟，再由平面几何原理，得到波的方位和波速。
With the correlation technique, direction and speed of the infrasound can be calculated by computing the time delay of each detector and by using geometric knowledge.
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