选择“减淡”工具，画笔大小设置为50，范围选择“高光”，设置好后在这个抽象形状的边缘和拐角处涂抹。
Select the "Dodge" tool and make the brush size around "50" and the "Range" to "highlights." Now use this tool around the edges and corners of your shape.
采用减薄硅片衬底厚度和光陷阱技术可望使转换效率达到29%。
It is possible to get 29% efficiency by reducing wafer thickness and employing light trapping technology.
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