去除光阻剂以后，其他机器会在蚀刻痕迹中填入各种各样的材料，如铜或铝，它们是构成处理器的组件之一。
After removing the photoresist, other machines can fill those trenches with various materials, such as copper or aluminum, that comprise the components of the processor.
第一项是使用更薄的光阻胶涂层以减小电子的散射。
The first was to use a thinner resist layer, to minimize electron scattering.
阻光率是透射率的倒数。
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