光切法是利用光切原理来测量表面粗糙度的一种测量方法，常用仪器是光切显微镜（又称双管显微镜）。
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轮廓提取是光切法的关键。
The key of the Light-sectioning Method is the outline extraction.
介绍了光切法的原理，并详细介绍了对所获得的数字图像进行处理的步骤。
Introduction included the principle of light-sectioning method and steps of processing the digital images were given in detail.
光切法是一种新型的三维表面轮廓的光电非接触测量方法，它主要有两个步骤：用CCD获取物体表面的轮廓信息；
Light Sectioning Method(LSM) is a new kind of the 3 D surface electric lighted nontouching measurement. There are two main steps:obtaining information of the curve surface of object by CCD;
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