元件制程：蚀刻，表面钝化，介电材料薄膜。
Device Processing: Etching. Surface passivation; dielectric films.
文章介绍了通过改造检测元件和控制程序更好的实现钢板头尾跟踪的措施。
This paper mainly presents how to improve head-tail tracking of plate by changing the detection component and modifying the control software.
最后，一通用于射频元件特性分析与制程监测的微型化测试结构亦被提出。
Finally, a miniature test structure for RF device characterization and process monitoring is also proposed.
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