元件制程：蚀刻，表面钝化，介电材料薄膜。
Device Processing: Etching. Surface passivation; dielectric films.
最后，一通用于射频元件特性分析与制程监测的微型化测试结构亦被提出。
Finally, a miniature test structure for RF device characterization and process monitoring is also proposed.
首件检查及制程检查有对产品的性能，元件料号进行确认，但对于指定的尺寸未有进行测量。
Product physical performance and part number is checked during First Article Inspection(FAI) and In-process Quality Check(IPQC), but the specified dimensions are not measured.
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