塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。

First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.

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钛酸铝是一种优异的高熔点、低膨胀无机非金属材料。

Aluminum titanate is an excellent inorganic non-metal material with high melting point and low expansion.

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采用粉末冶金技术制备了一种低膨胀高导热支撑材料(简称DG合金)，研究了烧结工艺对合金组织和性能的影响。

A support material with low expansivity and high conductivity, called DG alloy, was prepared by powder metallurgy. The effects of sintering process on its properties and microstructure were studied.

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