低温退火(low temperature annealing) 钢件的加热温度低于Fe—C合金加热时共析转变温度(Ac1)的退火。低温退火的目的是使钢件软化，以便于切削加工或随后进行的冷变形。低温退火包括软化退火和再结晶退火。
通过低温退火，可以获得质量优于高温退火的顶部硅层。
The quality of top silicon layer formed by anneal at low temperature may be better than that at high temperature.
低温退火可以避免在顶部硅层中氧沉淀及延伸位错等缺陷的形成。
The formation of oxygen precipitates and threading dislocations in top Si layer could be avoided by low temperature annealing.
论文还研究了不同退火工艺条件对薄膜应力的影响，可以实现薄膜低温退火。
The affection of different annealing process conditions on TiN film stress is also researched, low temperature annealing of film can be realized.
应用推荐