基于铁氧体及陶瓷的方案的构造及封装会使用铁氧体或低温共烧陶瓷(LTCC)作为构建线圈的衬底。基于较大铁氧体及陶瓷构建的方案性能最佳,但会占用大部分的电路板面积。
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...文化艺术 - xzbu.com 中国论文网 关键词低温共烧陶瓷,基板,玻璃/陶瓷 [gap=9599]Keywords: low temperature co-fired ceramics (LTCC),substrate,glass/ceramic ...
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...primary crystalline phase material; liquid phase sintering 用于封装的低温共烧陶瓷(LTCC-Low Temperature Co-fired Ceramic)的烧结温度约在 950 ℃以下,低于 银和金的熔点,可与各种电阻和绝缘材料一次性烧结 形成无源器件,对烧结气氛没有特殊的要求。
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The Low temperature co-fired ceramic(LTCC) technology has the embedded passive components,high integration,fine reliability and excellent characteristic of high frequency and become one of the more influence and emulative technologies in wireless communication systems.
低温共烧陶瓷(LTCC)技术具有内埋置无源元件、集成度高、可靠性好以及优良的高频特性等特点,成为无线通讯系统中更具影响力与竞争力的技术之一。
参考来源 - LTCC五阶LC带通滤波器的设计与关键工艺分析·2,447,543篇论文数据,部分数据来源于NoteExpress
还介绍了低温共烧陶瓷基板以及向微波频率扩展的前景与相应的工艺要求。
Compared with conventional microwave network, the LTCC substrate and its future expanding to microwave and corresponding technical requirements are also introduced in the paper.
指出了不同硼硅酸盐玻璃材料的优缺点和在低温共烧陶瓷技术中的适用范围。
The merits and defeds of different borosilicate glasses, its application field in LTCC technology were indicated.
本文提出一种新型的基于低温共烧陶瓷技术(LTCC)的螺旋电感带通滤波器。
A novel spiral inductor resonator bandpass filter based on LTCC is proposed in this paper.
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