在此基础上，建立了以单晶硅为工件材料的分子动力学仿真三维模型，对不同深度下的加工过程进行分析研究。
Then, based on these theories, the three-dimensional model with using monocrystal silicon as the workpiece is built and the processes of different grinding deepness is studied.
将三维动态切削力施加到机床响应模型上，仿真出实际加工过程中存在于刀具和工件之间的动态位移参量。
The dynamic increments in three-dimensions between the cutting tool and workpiece have been simulated by putting the cutting forces to the machining system response model.
通过计算机仿真技术，模拟刀具、工件几何体、加工环境及刀具路径和材料去除的过程，最终在加工之前得到了合理、优化的加工方案。
The tool, part geometry, machining conditions, tool-path and the material removal process are simulated by computer simulating technology to gain a rational optimized milling plan finally.
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