介电分析比较简单，并能得到其它方法不可能得到的结果。
Dielectric analysis is much the simpler, yielding results that may be unattainable by other methods.
本文介绍了介电分析法在热固性树脂及以其为基体的涂料和纤维增强复合材料固化研究中的应用。
The paper reviewed the use of dielectric analysis to study the curing process of thermosetting matrix system including organic coatings and composites.
采用不同的沉积氧气压，分析了其对薄膜微观结构和介电性能的影响。
Study indicated that oxygen deposition pressure exerts a strong impact on the microstructure and the dielectric properties of the films.
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