... 互连模式 interconnection pattern 互连膜 interconnection film 互连设备 interconnect equipment ...
基于34个网页-相关网页
该半导体晶片上形成的一层互连膜与绝缘膜的可靠性可以在加速条件下加以评估。
The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
互连结构用材料。第5部分：有或无涂覆的导电箔和膜的分规范组。第4节：导电油墨。
Materials for interconnection structures. Part 5 : sectional specification set for conductive foils and films with or without coatings. Section 4 : conductive inks.
金属化是淀积一层薄薄的金属膜的工艺，将其制成模版用于形成所需的内部互连排列。
Metallization is the process of depositing a thin film of metal and patterning it to form the desired interconnection arrangement.
应用推荐