对互连寄生电容提取的研究背景进行了简要的介绍。

In this paper, the background of parasitic capacitance extraction of interconnects are briefly introduced.

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介绍复杂互连寄生电容器的结构及对其实现虚拟多介质切割的方法。

In this paper, the complex 3D structures of VLSI interconnect capacitors and the virtual cutting method for them are presented.

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通过分析互连几何参数波动与互连寄生参数的关系，得到其近似的函数关系表达式。

The approximate function relationships are obtained by analyzing the impact of interconnect geometric parameters fluctuation on the interconnect parasitic parameters.

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