对互连寄生电容提取的研究背景进行了简要的介绍。
In this paper, the background of parasitic capacitance extraction of interconnects are briefly introduced.
介绍复杂互连寄生电容器的结构及对其实现虚拟多介质切割的方法。
In this paper, the complex 3D structures of VLSI interconnect capacitors and the virtual cutting method for them are presented.
通过分析互连几何参数波动与互连寄生参数的关系,得到其近似的函数关系表达式。
The approximate function relationships are obtained by analyzing the impact of interconnect geometric parameters fluctuation on the interconnect parasitic parameters.
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