对于垂直通孔互连问题，时域有限差分法更具优势。
FDTD method is better than the other one for vertical via interconnect problem.
采用虫孔切换技术容易造成互连网络寻径的死锁。
The interconnection networks which USES the wormhole switching technology can easily make deadlock.
本研究重点研究了MCM—C基板的可靠性，包括厚膜电阻，基板布线以及互连通孔。
This paper mainly studies the reliability of substrates of MCM-C including thick-film resistors, metal lines and vias for interconnection.
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