以环氧树脂为基体，间苯二胺和氨基二苯甲烷的低融点混合物为固化剂，铜粉为导电填料，制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the con-ducting filler.
以环氧树脂为基体，间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂，铜粉为导电填料，制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
本文报道了利用差示扫描量热仪（DSC）跟踪4，4’-二氨基二苯甲烷四缩水甘油基环氧树脂（TGDDM）与4，4’-二氨基二苯甲烷（DDM）固化体系的固化反应研究的结果。
Studies on the cure reaction of tetraglycidyl 4 , 4'-diaminodiphenyl methane (TGDDM) epoxy with 4, 4'-diaminodiphenyl methane (DDM) has been made by using differential scanning calorimetry (DSC).
应用推荐