·2,447,543篇论文数据，部分数据来源于NoteExpress
建立了一种大功率LED的封装结构，二次光学设计采用了微透镜阵列技术，运用光线追踪法研究了这种封装结构的光学性能。
A packaging structure of high-power LED was presented, microlens array was employed in the secondary optical design, optical properties of the package was studied using Trace pro.
系统研究了二次涂敷封装方案对光纤光栅（FBG）温度特性的影响。
The influence of the second coating on the fiber Bragg Grating(FBG) temperature sensitivity is researched.
磁芯经过二次退火后，由于封装胶发生膨胀使得被封装的磁芯电感值严重下降，软磁性能下降。
After cores being secondary annealed, expansion of packaging glue happen, which causes that the inductance value of magnetic-cores declined seriously, soft magnetic properties reduced.
应用推荐