将具有与所述多个第一柱对应得多个第二柱的多个裸片放置在所述母器件晶片上。

Plural dies having plural second posts corresponding to the first posts are placed onto the mother device wafer.

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结果73例脊柱爆裂性骨折中二柱受累27例，三柱受累46例，骨性椎管狭窄66例。

Results Two columns were involved in 27 cases, three columns involved in 46 cases, and narrow spinal canal in 66 cases.

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接着，使所述焊料回流以接合所述多个第一柱和所 述多个第二柱，并且切割所述母器件晶片。

Then, the solder is reflowed to bond the first and second posts, and the mother device wafer is diced.

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