适合金丝键合 Fit to gold wire bonding
粗丝键合 Large diameter wire bonding
键合金丝 bonding gold wire
铝键合丝 TABR
半导体封装用键合丝 bonding wire
丝键合
Wire bonding
以上为机器翻译结果，长、整句建议使用 人工翻译 。
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
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