以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。

This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.

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该表达式与器件静特性、功率因数、调制度及负载电流有关，利用其计算不同载波调制下通态损耗时只需改动导通占空比。

The results clearly show conduction losses are the function of semiconductor static characteristic, power factor, modulation depth and load current.

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If you're in this state, you will necessarily, given the laws of physics and the way the computer's programmed and built and so forth, these wires will turn on, turn off, these circuits will turn on, turn off, boom, suddenly you'll be in that state.

如果你站在这个角度,你必定会考虑,在物理定律和电脑编程原理,如何构造的等等确定的情况下,这些电线通或断,这些回路通或断,嘣,突然你就处在那个位置上

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