建立了三维切削下切屑厚度的数学表示，提出了递延累加切屑厚度计算算法。
The calculation formula of the chip thickness was established under 3D cutting process and an uncontinuable adding up calculation algorithm of the chip thickness was proposed.
通过三维切削模拟可以获得在不同刃倾角精密切削过程的条件下切屑形状、切削力和切削温度场的分布情况。
The effects of tool's inclination angle on chip formation and the temperature fields, as well as the cutting forces, back forces and feed forces are discussed.
对三维光弹性试验的有关工艺，如材料制造、切削加工、冻结、切片等方面也提出了看法。
The authors however express their views on the technology of the three dimensional photoelastic test, such as material manufacturing cutting process, freezing and sectioning.
应用推荐