在此基础上，建立了以单晶硅为工件材料的分子动力学仿真三维模型，对不同深度下的加工过程进行分析研究。
Then, based on these theories, the three-dimensional model with using monocrystal silicon as the workpiece is built and the processes of different grinding deepness is studied.
该文利用有限元法对电容式角位移传感器三维电场进行分析，仿真研究不同结构参数的敏感元件，所得结论与实验结果吻合。
Electric field of capacitive angular sensor are analyzed by finite element methodology. Sensors with different dimensions are studied by simulation. The result is proved by the experiment.
文中还分析了采用三维SVPWM时逆变器的电压利用率，给出了基于所提算法和其它3种调制方法的四桥臂逆变器仿真结果。
Moreover, the voltage utilization ratio of the inverter with 3D-SVPWM is analyzed, and the simulated results of the four-leg inverter with the four above-mentioned methods are compared.
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