... 一级讯息成员 first level message member 一级封装 first level of packaging 一阶协定 first level protocol ...
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一级封装中最流行的互连技术仍为丝焊。
Wire bonding is still the most popular interconnect technology in the first-level packaging.
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AspectJ在AOP技术中差不多是惟一支持这一级别的封装的。
AspectJ is nearly unique among AOP technologies in supporting encapsulation at this level.
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