The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.

该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。

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The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).

该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。

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