abrasive wire sawing machine 砂线切割机床
Wire sawing off 绳锯木断
Wire-sawing 线锯
wire sawing model 线锯切割模式
multi-wire sawing 多丝切割
fixed abrasive multi-wire sawing 固着磨料多线锯
Multi-wire sawing process has the advantages of high productivity and thin damage layer of the sliced surface. Improving the wire stiffness to reduce wire vibration can further improve the accuracy and surface quality of wafers.
提高切割线的刚度,减小线的横向振动,可提高线切割精度和切割线的利用率。
参考来源 - 半导体晶片的金刚石工具切割技术·2,447,543篇论文数据，部分数据来源于NoteExpress
The wire sawing process has been applied to slice single silicon into thin wafers for its character of minimum warp, uniform thickness and low kerf loss.
由于线锯切割具有切片薄、表面翘曲变形小、厚薄均匀和切口损失小等优点，被广泛用于单晶硅切片加工。
Including: Sawing, punching, turning, drilling, tapping, milling, polishing, wire-drawing, CNC processing, bending, forming and other deep processing, argon arc welding and assembly.
包括：锯切、冲压、车削、钻孔攻丝、铣、焊接、抛光、拉丝、数控加工、弯曲、成型等深加工、氩弧焊接、装配。
The preparation of sawing wire base and the sawing wire plating process are introduced.
研制了一种新型环形电镀金刚石线锯，介绍了锯丝基体的制备及锯丝电镀工艺。
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