aluminum wire bond 铝线热压焊接
Wire Bond Engineer 技术工程师
Die Bond Wire Bond 完成封装工作
Wire Bond Logic 打线接合逻辑系统
Wire Bond Substrate 打线载板
Wire bond broken 金线破损
wire bond pulling 键合拉力
Wire bond collapse 金线倒塌
Wire Bond Shear Test 金属丝连接剪切测试
·2,447,543篇论文数据，部分数据来源于NoteExpress
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
The yield of wire bond mainly depends on the bondability of the bond pad which is affected by the surface characteristics.
引线键合的效率主要依赖于受表面特性影响的键合点的可焊性。
The bond pad (28) is then formed in contact with the barrier (26), and a wire bond (30) is then made to the bond pad (28).
随后形成接合焊盘（28）以接触阻挡（26），且随后对接合焊盘（28） 完成线接合（30）。
应用推荐