The results show that the wetting capability and the wetting speed of as solution on TATB explosive decreases with increasing of the concentration of as solution.
研究表明，随着聚合物溶液浓度的增加，AS溶液在TATB表面的浸润性变差，浸润速度减小。
Having optimized preheat temperatures, solder pot temperatures, and flux volume, the conveyor speed may have to be reduced to accommodate the solder wetting when using lead-free solder.
对预热温度、焊料槽温度和焊剂体积进行优化后，还可将传送带速度降低，以适应使用无铅焊料时的熔湿速度。
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