The experiments show that soldering temperature play the most important role on wetting force.
试验结果表明，钎焊温度对润湿力作用显著。
In addition to the wetting force, any significant immersion of the fiber in the liquid will induce a buoyancy force.
在润湿力之外，纤维实际浸渍在液体中时，还要产生一种浮力。
The causes for defects from the point of wetting force for the flux activity of solder paste were studied, the solder paste according to the wetting force was selected.
对焊膏的助焊剂活性从润湿力的角度研究导致缺陷的成因，并根据润湿力选择备选焊膏。
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