This paper describes new development of wet plating process in micro fine circuit formation. It can form micro fine circuit pattern on improved performance polyimide film.

概述了在微细线路形成中湿式镀工艺的新开发，可以在改性聚酰亚胺膜上形成微细线路图形。

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Several composite technologies and development situation of equipments such as dry and wet forming, hot-melt and transfer coating processes were discussed.

介绍了热熔、干法、湿法和转移涂层各种复合技术的工艺与设备的开发情况。

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Performance, spinning technology circulation, parameters choice of each process, technology measures and development direction of conduct wet polyester fibers were introduced.

介绍了导湿涤纶纤维的性能、纺纱工艺流程、各工序的工艺参数选择、技术措施、质量指标及今后的开发方向。

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