Its comprehensive coverage focuses on printed circuits, integrated circuits, contact materials, semiconductors, wire, bonding, brazing, soldering, and welding.
它的广泛报导集中在印刷电路、集成电路、连接材料、半导体、导线、粘结、钎焊、焊锡和焊接。
This paper analysed and calculated the dynamic yielding strength of plastic deformed metal in the bonding zone of explosive welding composite material in the condition of explosive welding.
用比拟的方法分析和计算了爆炸焊接条件下，爆炸复合材料结合区中塑性变形金属的动态屈服强度值。
Although the interface has the features of melt, and pressure welding, the molten and diffusion welding cannot explain the bonding mechanism of explosive welding.
实验表明，爆炸焊接界面虽然具有熔化、扩散和压力焊的特征，但不能用熔焊和扩散焊机理来解释爆炸焊接界面的成因。
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