This paper introduces a number of bare and multichip module stacking technologies that are emerging to meet the ever increasing demands for low power consumption, low weight and compact systems.

简要介绍为满足日益增长的低功耗、轻重量、小体积系统的应用需求而涌现出的多种裸芯片封装与多芯片叠层封装技术。

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Products, as one of a great deal of achievements of the human cultural activity, are carriers and symbols of meaning too, and it bare the weight of meaning's transmitting and communicating.

产品，作为人类文化活动的诸多成果之一，也是意义的载体和符号，承载着意义传递和沟通的重任。

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