集成电路封装中的引线键合技术 -云南光电技术讨论区 关键词: 引线键合；球形焊接；楔形焊接；反向键合 [gap=906]Key words: Wire Bonding; Ball Bonding; Wedge Bonding; Reverse Bonding
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thick aluminum wire wedge bonding 粗铝丝引线键合 ; 粗铝丝超声引线键合
automatic wedge bonding 自动楔焊键合
heavy aluminum wire wedge bonding 粗铝丝引线键合
Bonding Wedge 楔形焊 ; [机] 楔焊头
wedge e bonding 楔形键合
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The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.
超声功率是影响粗铝丝引线键合强度的最主要因素之一。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
The effect of bonding time on the bonding strength of thick aluminum wire wedge bonding was studied under different ultrasonic power conditions.
试验研究了不同超声功率条件下，键合时间对粗铝丝引线键合强度的影响规律。
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